GE IC698CHS217 Backplane Module, Modular, High-Speed
The GE IC698CHS217 is a chassis for the RX3i PACSystems, supporting up to 17 slots for I/O and intelligent modules. It operates in a temperature range of 0°C to 60°C and supports a variety of communication protocols. Typical applications include industrial automation in manufacturing, energy management, and process control. Compared to other models like the IC698CPE030-HN, the IC698CHS217 offers greater modularity and scalability, making it suitable for larger and more complex systems. Unlike the IC693CPU363, it integrates with newer technology standards.
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